Device and method for vacuum deposition, and organic electroluminescent element provided by the device and the method

ABSTRACT

A vacuum deposition device, wherein an evaporation source  2  and a deposited body  3  are disposed in a vacuum chamber  1  and a space between the evaporation source  2  and the deposited body  3  is surrounded by a tubular body  4  heated at a temperature for vaporizing the substances of the evaporation source so that the substances vaporized from the evaporation source  2  can reach the surface of the deposited body  3  through the inside of the tubular body  4  and then be deposited thereon, and a control member  8  for controllably guiding the movement of the vaporized substances to the deposited body  3  inside the tubular body  4  is installed in the tubular body  4 , whereby the distribution of the vaporized substances adhered onto the deposited body can be controlled so that deposition with uniform film thickness can be performed on the deposited body and, as the case may be, the deposition can be performed with an intentionally set film thickness distribution.

TECHNICAL FIELD

The present invention relates to a device and a method for a vacuumdeposition which evaporates an evaporation source under a vacuumatmosphere and deposits an evaporation substance to a deposited body,and an organic electroluminescent element produced by the device and themethod.

BACKGROUND ART

The vacuum deposition device is structured such that the evaporationsource and the deposited body are arranged within a vacuum chamber, thedeposited material is melted so as to be evaporated or the depositedmaterial is sublimated by heating the evaporation source in a state inwhich an inner side of the vacuum chamber is pressure reduced, therebybeing vaporized, and the vaporized substance is accumulated on a surfaceof the deposited body so as to be deposited. The vaporized substancewhich is heated and is generated from the evaporation source is linearlydischarged in a normal direction from the evaporation source, however,since a discharge space is kept in a vacuum state, the vaporizedsubstance linearly moves, and is attached to the surface of thedeposited body arranged so as to oppose to the evaporation source,thereby being deposited.

However, since the vaporized substance is linearly discharged in thenormal direction from the evaporation source, there is a lot ofvaporized substance which does not move toward the deposited body. Sincethe vaporized material which does not move toward the deposited body asmentioned above is not attached to the surface of the deposited body,there are problems that a yield ratio of the evaporation source becomeslow and a deposition speed to the surface of the deposited body becomesslow. Accordingly, as disclosed in Japanese Unexamined PatentPublication Nos. 4-45259 and 9-272703, there has been proposed a vacuumdeposition device structured such that a space in which an evaporationsource arranged within a vacuum chamber and a deposited body oppose toeach other is surrounded by a tubular body, and the tubular body isheated at a temperature by which the substance of the evaporation sourceis vaporized, whereby the substance vaporized from the evaporationsource is vacuum deposited to the surface of the deposited body throughthe inner side of the tubular body.

FIG. 15 shows an embodiment of the structure. In the structure, atubular body 4 open to upper and lower sides is arranged within a vacuumchamber 1, and a heater 11 is wound around the tubular body 4 so as toheat the tubular body 4. An evaporation source 2 is arranged so as toface to an opening portion 12 in a lower end of the tubular body 4, anda deposition material can be vaporized by heating a heater 13. Adeposited body 3 is arranged in an upper side of an opening portion 14in an upper end of the tubular body 4, and the opening portion 14 can beopened and closed by a shutter 15. Reference numeral 16 denotes a heaterfor heating the deposited body 3.

In the structure mentioned above, when the deposited material isvaporized by pressure reducing an inner side of the vacuum chamber 1 andheating the evaporation source 2, and the shutter 15 is opened, thesubstance vaporized from the evaporation source 2 flies within thetubular body 4 so as to pass through the inner side of the tubular body4, and is attached to the surface of the deposited body 3 through theopening portion 14 in the upper end of the tubular body 4, whereby thedeposition can be achieved by accumulating the vaporized substance onthe deposited body 3. Further, in the structure mentioned above, since aspace in which the evaporation source 2 and the deposited body 3 areopposed to each other is surrounded by the tubular body 4, the vaporizedsubstance can be moved toward the deposited body 3 while being reflectedby the inner surface of the tubular body 4 in a state in which thevaporized substance generated from the evaporation source 2 issurrounded within the tubular body 4, and most of the vaporizedsubstance generated from the evaporation source 2 can reach the surfaceof the deposited body 3, whereby it is possible to execute thedeposition at a high yield ratio while reducing an amount which escapeswithout being attached to the deposited body 3. Further, since thetubular body 4 is heated by the heater 11, the tubular body 4 isreheated so as to be re-vaporized even in the case that the vaporizedsubstance is attached to the inner surface of the tubular body 4. There-vaporized substance reaches the deposited body 3 so as to form adeposition layer, and the vaporized substance is not accumulated on thetubular body 4 so as to lower the yield ratio.

As mentioned above, it is possible to execute the deposition at a highyield ratio by surrounding the space between the evaporation source 2and the deposited body 3 by the heated tubular body 4, however, sincethe vaporized substance is linearly discharged in the normal directionfrom one evaporation source 2, an amount of accumulation of thedeposited substance is different between a center portion and an endportion of the deposited body 3, and there is a problem that a filmthickness of the deposition tends to be uneven. In other words, since adistance from the evaporation source 2 to the end portion of thedeposited body 3 is longer than a distance from the evaporation source 2to the center portion of the deposited body 3, the amount ofaccumulation of the deposited substance is more in the center portion ofthe deposited body 3 in which the distance from the evaporation source 2is short, and the amount of accumulation of the deposited substance isless in the end portion of the deposited body 3 in which the distancefrom the evaporation source 2 is long. In particular, in the case thatthe space between the evaporation source 2 and the deposited body 3 issurrounded by the heated tubular body 4, the deposited substanceattached to the inner periphery of the tubular body 4 is re-evaporatedand discharged, so that there is a risk that an unevenness in the filmthickness of the deposition becomes larger in accordance with the designof the tubular body 4.

The present invention is made by taking the points mentioned above intoconsideration, and an object of the present invention is to provide adevice and a method for a vacuum deposition which can apply a depositionto a deposited body at an even film thickness and can execute thedeposition by intentionally setting a film thickness distribution insome cases.

On the other hand, the deposition can be executed in accordance with amethod of vaporizing the deposition material arranged within a baseportion of the tubular body 4, making the evaporation substance to flywithin the tubular body 4, and attaching the flied vaporizationsubstance to the deposited body 3 arranged so as to face to the openingportion 14 in the upper end of the tubular body 4 through the openingportion 14. However, in the structure mentioned above, in the case ofapplying the deposition to an entire surface of the surface of thedeposited body 3, it is necessary to arrange the deposited body 3 so asto enter into an area of the opening portion 14 of the tubular body 4.Accordingly, it is necessary to make a magnitude of the opening portion14 of the tubular body 4 larger than an area of the deposited body 3.For example, in the case that the deposited body 3 is a plate memberhaving a dimension equal to or more than 200 mm in one line, it isnecessary to form the opening portion 14 of the tubular body 4 equal toor larger than the deposited body.

In this case, the vaporized substance vaporized from the evaporationsource 2 arranged within the base portion of the tubular body 4 flieswithin the tubular body 4 and reaches the opening portion 14, however, adistribution of concentration of the vaporized substance passing throughthe opening portion 14 is not uniform, but the concentration of theevaporated substance becomes higher particularly in a portioncorresponding to a position where the evaporation source 2 is arranged,and the concentration of the vaporized substance becomes lower in aperipheral portion of the opening portion 14. Further, in the case thatthe area of the opening portion 14 of the tubular body 4 is small, theunevenness in the distribution of concentration of the vaporizedsubstance does not become so large in the center portion and theperipheral portion, and no specific problem is generated. However, inthe case that the opening portion 14 becomes a great area such as anarea having one line equal to or larger than 200 mm, a difference ofconcentration is largely generated between the vaporized substancepassing through the center portion of the opening portion 14 and thevaporized substance passing through the peripheral portion, so thatthere is generated a problem that the deposition film thickness becomeuneven such that the film thickness of the deposition film deposed onthe deposited body 3 is thick in the center portion and thin in theperipheral portion.

The present invention is made by taking the points mentioned above intoconsideration, and an object of the present invention is to provide amethod for a vacuum deposition which can apply a deposition to adeposited body having a great area at a uniform film thickness.

DISCLOSURE OF THE INVENTION

In accordance with the present invention, there is provided a vacuumdeposition device in which an evaporation source and a deposited bodyare arranged within a vacuum chamber, a space between the evaporationsource and the deposited body is surrounded by a tubular body heated ata temperature by which a substance of the evaporation source isvaporized, and the substance vaporized from the evaporation source ismade to reach a surface of the deposited body through an inner side ofthe tubular body so as to be deposited, wherein a control member forcontrolling so as to guide a movement of the vaporized substance towardthe deposited body within the tubular body is provided within thetubular body.

Further, in accordance with the present invention, in the structurementioned above, the control member is formed by a plate member providedwith a plurality of through holes through which the vaporized substancepasses, and the plate member is arranged so as to close an innerperiphery of the tubular body.

Further, in accordance with the present invention, in the structurementioned above, the control member is formed by arranging a pluralityof through holes in such a manner as to be non-densely distributed in apredetermined portion of the plate member and to be densely distributedin the other predetermined portion.

Further, in accordance with the present invention, in the structurementioned above, the control member is formed in a curved shapecorresponding to a curved shape of the surface to which the depositedbody is deposited.

Further, in accordance with the present invention, in the structurementioned above, the control member is arranged so as to beapproximately parallel to the surface to which the deposited body isdeposited.

Further, in accordance with the present invention, in the structurementioned above, the control member is formed by heating up to atemperature by which the substance of the evaporation source isvaporized.

Further, in accordance with the present invention, in the structurementioned above, an opening portion of the tubular body is formed in arectangular shape constituted by a long line and a short line, and thevacuum deposition device is provided with a means for moving thedeposited body in which a length of a line extending along the long lineis shorter than a length of the long line, and a length of a lineextending along the short line is shorter than a length of the shortline, in a direction parallel to the short line so as to cut across theopening portion.

Further, in accordance with the present invention, in the structurementioned above, the tubular body is formed such that an area of anopening portion in the leading end of the tubular body is smaller than across sectional area of a base portion of the tubular body, by making adimension of the opening portion in the leading end of the tubular bodysmaller than a dimension of the base portion of the tubular body inwhich the evaporation source is set.

Further, in accordance with the present invention, in the structurementioned above, the tubular body is formed such that an area of theopening portion in a leading end of the tubular body is smaller than across sectional area of a base portion of the tubular body, by making ashort line of the opening portion in the leading end of the tubular bodysmaller than a dimension of the base portion of the tubular body inwhich the evaporation source is set.

Further, in accordance with the present invention, in the structurementioned above, the control member is constituted by a porous platewhich is arranged in a side close to the evaporation source and isprovided with a through hole passing the substance evaporated from theevaporation source therethrough, and a pair of obstacle plates which arearranged in a side close to the opening portion and are provided so asto protrude in opposition to respective inner surfaces close to the longlines of the opening portion, and a width of a gap between therespective leading ends of the obstacle plates becomes narrower towardthe center portion of the long line in the opening portion and widertoward the end portion.

Further, in accordance with the present invention, in the structurementioned above, the control member is constituted by a porous platewhich is arranged in a side close to the evaporation source and isprovided with a through hole passing the substance evaporated from theevaporation source therethrough, and a pair of obstacle plates which arearranged in a side close to the opening portion and are provided so asto protrude in opposition to respective inner surfaces close to the longlines of the opening portion, and a width of a gap between therespective leading ends of the obstacle plates becomes narrower towardthe center portion of the long line in the opening portion and widertoward the end portion.

Further, in accordance with the present invention, in the structurementioned above, the tubular body is formed in an approximatelyperpendicularly bent shape so as to open an opening portion in one endof the tubular body in an approximately horizontal direction, and thedeposited body is arranged so as to oppose to the opening portion.

Further, in accordance with the present invention, in the structurementioned above, a pair of approximately perpendicularly bent tubularbodies are arranged so as to oppose opening portions in one end thereofto each other, and the deposited body is arranged between the opposingopening portions.

Further, in accordance with the present invention, in the structurementioned above, the tubular body is formed in a shape bent at anapproximately 180 degree so as to open an opening portion in one endthereof to a lower side, and the deposited body is arranged so as tooppose to the opening portion.

Further, in accordance with the present invention, in the structurementioned above, the deposited body is formed as a plate member havingan approximately square shape in which each of lines is equal to or morethan 200 mm.

Further, in accordance with the present invention, in the structurementioned above, the deposited body employs a deposited body having arecess portion, and the opening portion in one end of the tubular bodyis formed in a shape which is inserted to the recess portion.

Further, in accordance with the present invention, there is provided avacuum deposition device in which an evaporation source and a depositedbody are arranged within a vacuum chamber, a space between theevaporation source and the deposited body is surrounded by a tubularbody heated at a temperature by which a substance of the evaporationsource is vaporized, and the substance vaporized from the evaporationsource is made to reach a surface of the deposited body through an innerside of the tubular body so as to be deposited,

-   -   wherein an opening portion of the tubular body is formed in a        rectangular shape constituted by a long line and a short line,        and the vacuum deposition device is provided with a means for        moving the deposited body in which a length of a line extending        along the long line is shorter than a length of the long line,        and a length of a line extending along the short line is shorter        than a length of the short line, in a direction parallel to the        short line so as to cut across the opening portion.

Further, in accordance with the present invention, there is provided avacuum deposition method in which an evaporation source and a depositedbody are arranged within a vacuum chamber, a tubular body in which aninner surface is heated at a temperature by which a substance of theevaporation source is vaporized, is arranged between the evaporationsource and the deposited body, and the vaporized substance is depositedto a surface of the deposited body by heating and vaporizing theevaporation source, and making the vaporized substance to reach thesurface of the deposited body while passing through the opening portionof the tubular body from the inner side of the tubular body,

-   -   wherein the deposition on the surface of the deposited body is        achieved by arranging the deposited body so as to face to the        opening portion of the tubular body, and making the substance        vaporized from the evaporation source to reach the deposited        body from the opening portion through the control member        arranged within the tubular body.

Further, in accordance with the present invention, there is provided anorganic electroluminescent element produced by employing the vacuumdeposition device mentioned above.

Further, in accordance with the present invention, there is provided anorganic electroluminescent element produced by employing the vacuumdeposition method mentioned above.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross sectional view showing an embodiment in accordancewith a mode for carrying out the present invention.

FIG. 2 is a plan view showing an example of a control member in theembodiment.

FIG. 3 shows a test of a vacuum deposition, in which FIG. 3(a) is agraph of test results, and FIG. 3(b) is a plan view showing a depositedbody used in the test.

FIG. 4 shows another embodiment in accordance with the mode for carryingout the present invention, in which FIGS. 4(a) and 4(b) are crosssectional views of respective parts.

FIG. 5 is a cross sectional view of a part showing the other embodimentin accordance with the mode for carrying out the present invention.

FIG. 6 is a cross sectional view of a part showing the other embodimentin accordance with the mode for carrying out the present invention.

FIG. 7 is a cross sectional view of a part showing the other embodimentin accordance with the mode for carrying out the present invention.

FIG. 8 is a cross sectional view of a part showing the other embodimentin accordance with the mode for carrying out the present invention.

FIG. 9 shows an embodiment in accordance with the mode for carrying outthe present invention, in which FIG. 9(a) is a front elevational crosssectional view and FIG. 9(b) is a plan view of a part thereof.

FIG. 10 shows another mode for carrying out the present invention, inwhich FIG. 10(a) is a front elevational cross sectional view and FIG.10(b) is a plan view of a part thereof.

FIG. 11 shows the other mode for carrying out the present invention, inwhich FIG. 11(a) is a front elevational cross sectional view and FIG.11(b) is a plan view of a part thereof.

FIG. 12 shows the other mode for carrying out the present invention, inwhich FIG. 12(a) is a front elevational cross sectional view and FIG.12(b) is a plan view of a part thereof.

FIG. 13 shows a control member in FIG. 12, in which FIG. 13(a) is across sectional view as seen from a line A-A in FIG. 12(a), and FIG.13(b) is a cross sectional view as seen from a line B-B in FIG. 12(a).

FIG. 14 is a principle view showing another structure of a carriermeans.

FIG. 15 is a cross sectional view showing a prior art.

BEST MODE FOR CARRYING OUT THE INVENTION

FIG. 1 shows an embodiment in accordance with a mode for carrying outthe present invention. A vacuum pump 20 is connected to an exhaust port18 provided in a side surface of a vacuum chamber 1 via a gate valve 19.A tubular body 4 is arranged within the vacuum chamber 1. A heater 21such as a sheath heater or the like is wound around an outer peripheryof the tubular body 4, and the structure is made such that the tubularbody 4 can be heated by feeding an electricity from a power source 22connected to the heater 21 so as to make the heater 21 to generate heat.

Further, an evaporation source 2 is arranged in a lower side of thetubular body 4, within a lower portion of the vacuum chamber 1. Acrucible 23, a heater 24 and a temperature sensor 25 are provided withinthe evaporation source 2, and the structure is made such that theevaporation source 2 is heated by feeding the electricity from a powersource 26 connected to the heater 24 so as to make the heater 24 togenerate heat, and the heat generation of the heater 24 can becontrolled on the basis of a temperature detected by the temperaturesensor 25.

The tubular body 4 is formed in an optional cross sectional shape suchas a cylindrical shape, a rectangular tube shape and the like, however,is formed in a straight tube in the embodiment shown in FIG. 1. A collarpiece 27 is extended to an inner periphery in a lower end of the tubularbody 4, and an opening portion 7 is formed in an inner edge thereof soas to open by a small diameter, whereby the evaporation source 2 is setat a position just below the opening portion 7. Further, an openingportion 5 in an upper end of the tubular body 4 is formed so as to beopen around an entire surface of an inner periphery of the tubular body4.

Further, a control member 8 is provided in an inner portion of thetubular body 4. In the embodiment shown in FIG. 1, the control member 8employs a structure formed by a plate member 10 in which through holes 9are provided in a plurality of positions, and is arranged such that anouter periphery of the plate member 10 is bonded to an inner peripheryof the tubular body 4 all around an entire periphery and the innerperiphery of the tubular body 4 is closed by the plate member 10.

On the other hand, in the present invention, an optional depositionmaterial M can be employed, for example, an organic material such as anorganic electroluminescent material or the like can be employed.Further, in order to carry out the deposition, the evaporation source 2is set to a position just below the opening portion 7 in the lower endof the tubular body 4, the deposited body 3 is horizontally set so as toface to the opening portion 7 in an upper end of the tubular body 4, andthe deposition material M is filled in the crucible 23. Next, an innerside of the vacuum chamber 1 is pressure reduced in a vacuum conditionby operating the vacuum pump 20, the evaporation source 2 is heated bymaking the heater 24 to generate heat, and the tubular body 4 is heatedby the heater 21. A heating temperature of the tubular body 4 is set toa temperature by which the substance vaporized from the evaporationsource 2 is re-vaporized in accordance with an evaporation or the likeeven when the substance is attached to the tubular body 4, and is notaccumulated on the surface of the tubular body 4.

When pressure reducing the inner side of the vacuum chamber 1 andheating the evaporation source 2 as mentioned above, the depositionmaterial M is vaporized in accordance with a melting, an evaporation ora sublimation, and the vaporized substance 31 generated from theevaporation source 2 is introduced into the tubular body 4 from theopening portion 7 in the lower end and goes straight within the tubularbody 4. Since a space between the evaporation source 2 and the depositedbody 3 in which the vaporized substance 31 goes forward is surrounded bythe tubular body 4, and a vaporized substance 31 is in a state of beingclosed within the tubular body 4, the vaporized substance 31 isreflected on the inner surface of the tubular body 4 and goes toward theopening portion 5 in the upper end as shown in FIG. 1. At this time,since the inner side of the tubular body 4 is closed by the plate member10 constituting the control member 8, the vaporized substance 31 withinthe tubular body 4 passes through a through hole 9 provided in the platemember 10, thereafter comes out from the opening portion 5 in the upperend of the tubular body 4, and reaches the surface of the deposited body3 arranged so as to face to the opening portion 5, whereby it ispossible to accumulate the vaporized substance 31 on the surface of thedeposited body 3 so as to achieve the deposition. As mentioned above,the vaporized substance 31 passes through the through holes 9 at aplurality of positions of the plate member 10 and goes toward thedeposited body 3, and the vaporized substance 31 is introduced from eachof the through holes 9 at a plurality of positions so as to reach thedeposited body 3. Accordingly, the vaporized substance 31 can reach thedeposited body 3 by a uniform distribution in comparison with the casethat the vaporized substance 31 reaches the deposited body 3 from theevaporation source 2 at one position, it is possible to attach thevaporized substance 31 to the deposited body 3 by a uniform distributionand it is possible to apply the deposition to the deposited body 3 by auniform film thickness.

In this case, tests are carried out by employing a square tube in whichone line of an inner wall is 120 mm and a height is 280 mm, for thetubular body 4, setting the heating temperature to 200° C., employingtris (8-hydroxykinolynate) aluminum complex (“Alq3” produced by DOJINDOLABORATORIES) for the evaporation source 2, and vacuum depositing to thedeposited body 3 constituted by a glass substrate of 100 mm×100mm×thickness 0.7 mm which is set horizontally at a distance of 300 mmfrom the evaporation source 2.

First, the test is carried out by employing the tubular body 4 providedwith no control member 8. Results shown by a sign “◯” in a graph in FIG.3(a) are obtained. The graph in FIG. 3(a) displays a ratio by settingthe center of the deposition surface of the deposited body 3 to “0”,plotting points per 10 mm along a diagonal line from the center,measuring a film thickness of the deposition in each of the points andsetting a film thickness of the center of the deposited body 3 to “1.0”,as shown in FIG. 3(b). As shown in the graph in FIG. 3(a), in the casethat the vacuum deposition is carried out by using the tubular body 4provided with no control member 8, the deposition film thickness islarge in the center portion of the deposited body 3, and the depositionfilm thickness is small in the end portion of the deposited body 3.Accordingly, the film thickness is large and uneven.

Next, as shown in FIG. 2, the deposition test is carried out byemploying the control member 8 formed by arranging the through holes 9having a diameter of 10 mm in eight positions at a uniform interval inthe peripheral edge portion of the plate member 10 having a line of 120mm and arranging the through hole 9 having a diameter of 5 mm in oneposition in the center, respectively, and placing the control member 8at a position 250 mm apart from the evaporation source 2 and 50 mm apartfrom the deposited body 3 so as to mount to the inner side of thetubular body 4. Results are shown by “●” in the graph in FIG. 3(a). Asshown in the graph in FIG. 3(a), the film thickness can be uniformizedby carrying out the vacuum deposition with employing the tubular body 4provided with the control member 8 with hardly changing the filmthickness ratio of the deposition film thickness in the center portionand the end portion of the deposited body 3.

As is seen in the tests mentioned above, it is possible to obtain a higheffect for uniformizing the film thickness of the deposition, byemploying the plate member 10 formed by distributing the through holes 9non-densely in correspondence to the portion in which the depositionfilm thickness of the deposited body 3 is large, and distributing thethrough holes 9 densely in correspondence to the portion in which thedeposition film thickness of the deposited body 3 is small, for thecontrol member 8. Further, in the case that the deposition is going tobe applied to a predetermined position of the deposited body 3 at alarge film thickness and to another predetermined position at a smallfilm thickness, the vacuum deposition can be carried out in a state ofsetting the film thickness distribution intentionally, by employing theplate member 10 in which the through holes 9 are distributed densely incorrespondence to the predetermined position and through holes 9 aredistributed non-densely in correspondence to the other predeterminedposition, for the control member 8. In this case, the denseness andnon-denseness in the distribution of the through holes 9 can be adjustedby changing a magnitude, a shape and the like of the through hole 9, inaddition to the number of the through holes 9.

There is shown an embodiment that an organic electroluminescent elementis produced by the vacuum deposition apparatus having the structure inaccordance with the present invention employing the control member.

A structure of the organic electroluminescent element employs4,4′-bis[N-(naphthyl)-N-phenyl-amino]biphenyl (“α-NPD” produced byDOJINDO LABORATORIES) for a hole transport layer, Alq3 for a layerserving both as a light emitting layer and an electron transport layer,and LiF and Al for a cathode, and employs an ITO glass substrate of 100m×100 m×0.7 mm as an anode.

The deposition device has three vacuum chambers, and is structured suchthat a space movement is of a rod handling type under a vacuumcondition. The first and third chambers are structured only by thechamber and the evaporation source in the same manner as that of theconventional one. The second chamber is provided with a tubular bodywhich is made of a stainless material (SUS316), is formed in arectangular tube shape having one line dimension of 120 mm and a heightof 280 mm and can be heated, within the chamber. The control member inFIG. 2 is provided in the second chamber. Further, a substrate is set ata distance 300 mm apart from the evaporation source, and the controlmember is positioned at a distance 250 mm. The present invention isapplied to the second chamber because the second chamber is structuredby the largest film thickness among the organic material layer, and animproved effect can be obtained.

α-NPD is deposited at a deposition speed of 1 to 2 Å/sec at a thicknessof 400 Å in the first chamber, Alq3 is deposited at a heatingtemperature 240° C. of the tubular body 4, at a deposition speed of 20Å/sec at a thickness of 800 Å in the second chamber, thereafter, LiF isdeposited at a deposition speed of 0.5 to 1.020 Å/sec at a thickness of1000 Å in the third chamber, and subsequently Al is deposited at adeposition speed of 10 Å/sec at a thickness of 1000 Å, under the reducedpressure of 1×10⁻⁶ Torr (1.33×10⁻⁴ Pa), by using the evaporation device.It is possible to confirm homogeneity having a size 100 mm×100 mm andhaving no dispersion of brightness in place, by sealing the obtainedorganic electroluminescent, and mounting an electrode for applying anelectricity. In this case, an unevenness in brightness is generated inthe organic electroluminescent element produced by using the heatingtubular body provided with no control member 8 in the second chamber, inthe case of comparing the center portion with the peripheral portion ofthe substrate.

As mentioned above, the vaporized material 31 vaporized from theevaporation source 2 is controlled within the tubular body 4, it ispossible to prevent the vaporized substance 31 from being dispersed inall directions, and it is possible to make most of the vaporizedsubstance 31 vaporized from the evaporation source 2 to reach thesurface of the deposited body 3 so as to attach thereto. Accordingly,most of the vaporized material 31 vaporized from the evaporation source2 is attached to the surface of the deposited body 3 so as to contributeto a film formation, whereby an ineffective material is reduced, and amaterial use efficiency of the deposition material M becomes high, sothat it is possible to carry out the deposition at a high yield ratio,and it is possible to make a film forming speed on the surface of thedeposited body 3. Further, since the tubular body 4 is heated andconstitutes a hot wall, even in the case that the vaporized substance 31is attached to the surface of the tubular body 4, the attached substanceis re-heated in the tubular body 4 so as to be vaporized. Further, theplate member 10 mounted so as to be in contact with the inner peripheryof the tubular body 4 is heated by a heat transfer from the tubular body4 and a radiant heat, the substance vaporized from the evaporationsource 2 is vaporized in accordance with a re-evaporation or the likeeven when the substance is attached to the plate member 10, and thevaporized substance 31 re-vaporized from the tubular body 4 and theplate member 10 is deposited to the surface of the deposited body 3 inthe same manner as mentioned above. Therefore, it is possible to preventthe vaporized substance 31 from being accumulated on the plate member 10forming the tubular body 4 and the control member 8 and from beingunusable, so that the yield ratio of the deposition is not lowered. Inthis case, in the case that the heating is insufficient only by the heattransfer from the tubular body 4 and the radiant heat such as the casethat the size of the plate member 10 is large and the like, it isdesirable to heat by adding a heater to the plate member 10.

FIG. 4 shows another embodiment in accordance with the mode for carryingout the invention. The structure is made such that a deposition surfaceserving as the deposited body 3 has a curved surface, and a shape of theplate member 10 constituting the control member 8 is formed so as tohave a curved shape corresponding to the curved surface of the depositedbody 3. For example, in the case that the deposition surface serving asthe deposited body 3 is formed in a concave curved surface as shown inFIG. 4(a), the plate member 10 in which the surface in the side of thedeposited body 3 is formed in a convex curved surface is employed.Further, in the case that the deposition surface serving as thedeposited body 3 is formed in a convex curved surface as shown in FIG.4(b), the plate member 10 in which the surface in the side of thedeposited body 3 is formed in a concave curved surface is employed. Theother structures are the same as those in FIG. 1. Further, it ispossible to uniformly make the vaporized substance 31 to reach thesurface of the deposited body 3 from each of the through holes 9provided in the plate member 10 by forming the shape of the plate member10 constituting the control member 8 in the curved shape correspondingto the curved surface of the deposited body 3 in the manner mentionedabove, even in the case that the deposited body 3 has the curvedsurface, whereby it is easy to carry out the vacuum deposition at auniform film thickness.

Further, it is possible to arrange the plate member 10 constituting thecontrol member 8 within the tubular body 4 in such a manner as to beparallel to the deposition surface of the deposited body 3 which is setso as to face to the opening portion 5 of the tubular body 4. A distanceL between each of the portions of the plate member 10 and each of theopposing portions of the deposition surface of the deposited body 4becomes uniform as shown in FIG. 4 by arranging the plate member 4 ofthe control member 8 in parallel to the deposition surface of thedeposited body 3 as mentioned above, and it is easy to carry out thevacuum deposition at a uniform film thickness.

In the case of forming the tubular body 4 in a straight tube asmentioned above so as to open the opening portion 5 to theperpendicularly upper side, the deposited body 3 arranged so as to faceto the opening portion 5 is set in a horizontal attitude. However, inthe case of setting the deposited body 3 in a horizontally arrangedattitude, the lower surface of the deposited body 3 corresponds to thesurface to which the deposition is applied, and can not be supported.Accordingly, there is a risk that the lower surface of the depositedbody 3 is deflected in a center portion due to its own weight inaccordance with an application of the gravity as shown by a chain linein FIG. 15 so as to be deformed. In the case of employing the thin plateshape structure for the deposited body 3, the center portion isdeflected due to its own weight and the deformation bending to protrudeto the lower side tends to be generated. In particular, the plate-shapedstructure having a large size tends to have a great deformation. In thecase that the deposition is applied to the deposited body 3 which isdeflected and deformed due to its own weight, the vaporized substancetends to be attached to the portion protruding to the evaporation source2 in the surface of the deposited body 3. Accordingly, the thickness ofthe film vaporized to the surface of the deposited body 3 becomesuneven, and there is a risk that a quality of the deposition isunstable.

Accordingly, in the embodiment shown in FIG. 5, the tubular body 4 isbent at right angles so as to be formed as an L-shaped tube. The tubularbody 4 formed by bending in the L shape is arranged such that the lowerportion is oriented in a vertical direction and the upper portion isoriented in a horizontal direction, and is structured such that theopening portion 7 in the lower end of the tubular body 4 is open to thelower side, and the opening portion 5 in the upper end of the tubularbody 4 is open to the horizontal direction. The structure is made suchthat the vacuum source 2 is set to a position just below the openingportion 7 in the lower end of the tubular body 4, the control member 8is provided within the portion near the opening portion 5 in the upperend of the tubular body 4, and the opening end surface of the openingportion 5 is formed as a vertical surface. Further, the deposited body 3is set such that the surface thereof is arranged so as to face inparallel to the opening portion 5, and in the case that the plate-shapedsubstrate is used as the deposited body 3, the deposited body 3 isarranged in a vertically rising attitude. In the embodiment shown inFIG. 5, the structure is made such that the deposited body 3 issupported in a vertical state by holding the upper end edge and thelower end edge (or four peripheral end edges) of the deposited body 3 bya supporting body 28. The other structures are the same as those of FIG.1.

Further, since the deposited body 3 is arranged in the vertical attitudein the case of carrying out the deposition in the manner mentionedabove, the deposited body 3 is not deformed due to the application ofthe gravity, so that it is possible to prevent the surface of thedeposited body 3 opposing to the opening portion 5 of the tubular body 4from being deformed. Accordingly, it is easy to uniformize the thicknessof the film deposited to the surface of the deposited body 3 whilepreventing the deposition from being deflected due to the deformation ofthe surface of the deposited body 3, so that the quality of thedeposition is stabilized.

In an embodiment shown in FIG. 6, a pair of tubular bodies 4 formed asthe L-shaped tube obtained by perpendicularly bending in the mannermentioned above are employed, a pair of tubular bodies 4 and 4 areopposed to each other in the respective upper end opening portions 5 and5 at a predetermined interval, and a pair of tubular bodies 4 and 4 arearranged within the vacuum chamber 1 in this state. The other structuresare the same as those in FIG. 1, and the evaporation source 2 isarranged just below each of a pair of tubular bodies 4 and 4. Further,the deposited body 3 is arranged and set between the opening portions 5and 5 of the tubular bodies 4 and 4 in such a manner that the surfacesin both sides face in parallel to the opening portions 5 and 5 of therespective tubular bodies 4 and 4. In the case of using the plate-shapedsubstrate for the deposited body 3, the deposited body 3 is arranged inthe vertically rising attitude, and the deposited body 3 is supported inthe vertical state by holding the upper end edge and the lower end edge(or four peripheral end edges) of the deposited body 3 by the supportingbody 28.

In the structure in accordance with the embodiment, when setting theevaporation source 2 just below each of a pair of tubular bodies 4 and4, pressure reducing the inner side of the vacuum chamber 1 and heatingeach of the evaporation sources 2, the vaporized material 31 vaporizedfrom the evaporation source 2 is introduced to each of the tubularbodies 4 and 4 from the lower end opening portions 7 and 7, and reacheseach of the surfaces in both sides of the deposited body 3 from each ofthe opening portions 5 and 5 in the upper end after passing through theinner side of each of the tubular bodies 4 and 4 while reflecting on theinner surface, whereby it is possible to simultaneously apply thedeposition to both surfaces of the deposited body 3. Accordingly, it ispossible to improve a productivity of the deposition process, and it ispossible to form the different deposition films on both surfaces of thedeposited body 3 by using the different evaporation sources 2 for theevaporation sources 2 set to a pair of tubular bodies 4 and 4. In thecase of using the deposited body obtained by laminating two substratesfor the deposited body 3, it is possible to simultaneously apply thedeposition to the surfaces of two substrates.

In an embodiment shown in FIG. 7, the tubular body 4 employs a U-shapedtube obtained by being bent in an inverse U shape at an angle of 180degree. The tubular body 4 formed by bending in the inverse U shape isarranged within the vacuum chamber 1 such that the opening portions 5and 7 in both ends are open toward a lower side. A collar piece 27 isextended out to an inner periphery in one end of the tubular body 4, theopening portion 7 is formed in an inner edge thereof so as to be open ata small diameter, and the evaporation source 2 is set at a position justbelow the opening portion 7. Further, the opening portion 5 in anotherend of the tubular body 4 is structured such as to be widely open aroundan entire surface of the inner periphery of the tubular body 4, anopening end surface thereof is formed in a horizontal surface, and theopening portion 5 is formed so as to be positioned in a lower side thanthe opening portion 7 in another end. The control member 8 is providedwithin a position near the opening portion 5. Further, the depositedbody 3 is arranged and set such that the upper surface thereof is facedin parallel to the opening portion 5, and in the case that theplate-shaped substrate is employed for the deposited body 3, thedeposited body 3 is arranged in a horizontally laid attitude. Since itis possible to arrange the deposited body 3 in the horizontal attitudewith setting the surface to be deposited to the upper surface, thedeposited body 3 can be supported in a state in which the lower surfaceof the deposited body is held by the supporting body 28. The otherstructures are the same as those in FIG. 1.

In the structure in accordance with the embodiment, when pressurereducing the inner side of the vacuum chamber 1 and heating theevaporation source 2, the vaporized substance 31 vaporized from theevaporation source 2 is introduced to the tubular body 4 from the lowerend opening portion 7 and reaches the upper surface of the depositedbody 3 from the opening portion 5 after passing through the inner sideof the tubular body 4 while reflecting on the inner surface thereof,whereby it is possible to apply the deposition to the upper surface ofthe deposited body 3. In this case, since the deposited body 3 ishorizontally arranged in a state in which an entire surface of the lowersurface is supported, the deposited body 3 is not deformed due to theapplication of the gravity, so that is possible to prevent the surfaceof the deposited body 3 opposing to the opening portion 5 of the tubularbody 4 from being deformed. Accordingly, it is easy to uniformize thefilm thickness deposited to the surface of the deposited body 3 whilepreventing the deposition from being deflected due to the deformation ofthe surface of the deposited body 3, and the quality of the depositionis stabilized. Further, in the structure mentioned above, it is possibleto set the set position of the evaporation source 2 and the set positionof the deposited body 3 to places which are close to each other, and itis possible to simultaneously carry out a work for supplying theevaporation source 2 and a work for replacing the deposited body 3.

FIG. 8 shows the other embodiment in accordance with the mode forcarrying out the present invention. In this structure, a deposited bodyhaving a recess portion 6 is employed for the deposited body 3, and thedeposition can be applied to the recess portion 6. In other words, theopening portion 5 in the leading end of the tubular body 4 is formed ina shape which is suitable for being inserted to the recess portion 6 ofthe deposited body 3, and the tubular body 4 in which the openingportion 5 is formed in this manner is arranged within the vacuum chamber1. In the embodiment shown in FIG. 8, the tubular body which is bent atright angles and is formed as an L-shaped tube as shown in FIG. 1 isemployed for the tubular body 4, the leading portion of the tubular body4 is narrowed so as to make the diameter of the opening portion 5 small,and the opening portion 5 is formed in a diameter capable of beinginserted to the recess portion 6 of the deposited body 3. The controlmember 8 is provided within a portion near the opening portion 5. Theother structures are the same as those in FIG. 1.

In the structure in accordance with the embodiment, when setting thedeposited body 3 in a state in which the opening portion 5 of thetubular body 4 is inserted to the recess portion 6, pressure reducingthe inner side of the vacuum chamber 1 and heating the evaporationsource 2, the vaporized substance 31 vaporized from the evaporationsource 2 is introduced to the tubular body 4 from the lower end openingportion 7, is discharged from the opening portion 5 after passingthrough the inner side of the tubular body 4 while reflecting on theinner surface thereof, and reaches the inner surface of the recessportion 6 of the deposited body 3, whereby it is possible to apply thedeposition to the inner surface of a position in which it is very hardto apply the deposition, such as the recess portion 6 of the depositedbody 3.

FIG. 9 shows an embodiment (corresponding to claim 17) in accordancewith the mode for carrying out the present invention. A vacuum pump 43is connected to aside surface of the vacuum chamber 1 via a gate valve42. The tubular body 4 is arranged within the vacuum chamber 1. Thetubular body 4 is formed in a square tube shape in which an uppersurface constitutes the opening portion 5, and a heater 41 such as asheath heater or the like is wound around an outer periphery thereof,whereby it is possible to heat the tubular body 4. The evaporationsource 2 is fitted and mounted to a center portion of a bottom surfacein the tubular body 4, and a deposition material M is filled in acrucible 23 of the evaporation source 2. A heater 24 for heating thedeposition material M is built in the evaporation source 2, and theheating temperature can be detected by a temperature sensor 25 formed bya thermo couple or the like. Further, a side opening portion 47 isformed in a side wall of the tubular body 4, and a film thickness meter48 is mounted so as to face to an inner side of the side opening portion47. The film thickness meter 48 is formed by a quartz oscillator filmthickness meter or the like, and can automatically measure the filmthickness of the film deposited and attached to the surface.

In this case, in the tubular body 4 formed in the square tube shape, theopening portion 5 in the upper end thereof is formed in a rectangularshape (an oblong rectangular shape) having a long line 5 a and a shortline 5 b. The deposited body 3 formed by the glass substrate or the likeis generally formed in an approximately square shape, the long line 5 aof the opening portion 5 is formed longer than one line of the depositedbody 3, and the short line 5 b of the opening portion 5 is formedshorted than one line of the deposited body 3. It is preferable that theshort line 5 b of the opening portion 5 is about one half to one quarterof the long line 5 a. Even in the case that the deposited body 3 employsa structure in which one line is equal to or more than 200 mm(preferably equal to or more than 300 mm, practically 1 m although anupper limit does not exist) and an area is great, an area of the openingportion 5 can be formed about one half to one quarter of the depositedbody 3.

Further, a carrier means K corresponding to a means for carrying thedeposited body 3 horizontally is provided above the tubular body 4. Thecarrier means K is, for example, as shown in FIG. 10, formed by a pairof horizontally arranged carrier rails 50 and a carrier jig 51, each ofthe carrier rails 50 is arranged so as to come across a near edge of thetubular body 4 from one side of the tubular body 4 and reach anotherside of the tubular body 4 as shown in FIG. 10(b) (a drawing obtained byseeing FIG. 10(a) from the above), and the carrier jig 51 is provided soas to bridge between a pair of carrier rails 50 and 50. The carrier jig51 is provided with a depositing opening portion 52 at a positionbetween the carrier rails 50 and 50 so as to be formed in a frame shape,and is structured such as to move along the carrier rail 50 in a rangefrom one side of the tubular body 4 to another side of the tubular body4 across the upper side of the opening portion 5 of the tubular body 4.The deposited body 3 formed by the glass plate or the like is mountedand set on the carrier jig 51 as shown in FIG. 10(a) in a state in whichthe lower surface of the deposited body 3 is faced to the depositingopening portion 52, whereby the deposition can be carried out at a timeof moving the carrier jig 51 from the side position of the tubular body4 to the position just above the opening portion 5 of the tubular body4.

In other words, the vacuum deposition device shown in FIG. 9 isstructured such that the opening portion of the tubular body 4 is formedin the rectangular shape constituted by the long line 5 a and the shortline 5 b, and the vacuum deposition device is provided with the carriermeans K for moving the deposited body 3 having the magnitude that thelength of the line extending along the long line 5 a is shorter than thelength of the long line 5 a and the length of the line extending alongthe short line 5 b is longer than the length of the short line 5 b inthe direction parallel to the short line 5 b so as to come across theopening portion 5.

Accordingly, in the case of using the vacuum deposition device formed inthe manner mentioned above and depositing the deposition material M tothe deposited body 3 such as the glass substrate or the like, first, theinner side of the vacuum chamber 1 is pressure reduced to the vacuumstate by operating the vacuum pump 43, and the tubular body 4 is heatedby generating heat by the heater 41. The heating temperature of thetubular body 4 is set to a temperature by which the vaporized substance31 from the evaporation source 2 is re-vaporized even when it isattached to the inner surface of the tubular body 4, and is notaccumulated on the inner surface of the tubular body 4. Further, thedeposition material M within the evaporation source 2 is vaporized byheating the heater 24 and the vaporized substance is dispersed withinthe tubular body 4.

Further, the deposited body 3 is mounted on the carrier jig 51 as shownin FIG. 10(a), and the carrier jig 51 is moved along the carrier rail50, whereby the deposited body 3 is moved from one side position of thetubular body 4 to the position just above the opening portion 5 of thetubular body 4 so as to be from a solid line position in FIGS. 9(a) and9(b) to a chain line position, and the deposited body 3 is moved toanother side position of the tubular body 4 by passing through theposition just above the opening portion 5. At a time of passing thedeposited body 3 across the position just above the opening portion 5 asmentioned above, the vaporized substance 31 from the crucible 23 isattached to the lower surface opposing to the opening portion 5 of thedeposited body 3 through the opening portion 5, whereby the depositioncan be achieved by accumulating the vaporized substance 31 on the lowersurface of the deposited body 3. The film thickness of the depositioncan be adjusted in correspondence to the number of passing across theopening portion 5, by carrying out the deposition by moving thedeposited body 3 across the opening portion 5 of the tubular body 4. Inaddition to carrying the deposited body 3 in one direction so as to comeacross the opening portion 5, it is possible to move the deposited body3 across the opening portion 5 by carrying in a reciprocating directionor carrying in a reciprocating direction at a plurality of times.

At this time, the deposited body 3 is structured such as to move in adirection parallel to the short line 5 b of the opening portion 5 at aposition within a range of the long line 5 a of the opening portion 5 inthe tubular body 4 so as to pass across the position just above theopening portion 5, and an entire surface of the lower surface in thedeposited body 3 comes across the position just above the openingportion 5, so that it is possible to deposit the vaporized substance tothe entire surface of the lower surface in the deposited body 3. In thiscase, even in the case that the deposited body 3 has a great area inwhich one line is equal to or more than 200 mm, it is possible to formthe area of the opening portion 5 smaller by forming the opening portion5 of the tubular body 4 in the rectangular shape constituted by the longline 5 a and the short line 5 b as mentioned above, and a difference inconcentration is small between the center portion and the peripheralportion at a time when the vaporized substance 31 from the evaporationsource 2 within the base portion of the tubular body 4 passes throughthe opening portion 5. Accordingly, the vaporized substance 31 isdeposited to the entire surface of the deposited body 3 at a uniformconcentration, and it is possible to carry out the deposition at auniform film thickness.

FIG. 11 shows the other embodiment of the vacuum deposition device shownin FIG. 9. In the embodiment shown in FIG. 9, the tubular body 4 isformed in the straight shape having the same inner diameter from thebase portion to the upper end opening portion 5, however, in theembodiment shown in FIG. 11, the structure is made such that thedimension of the short line 5 b of the opening portion 5 in the upperend of the tubular body 4 is made smaller than the dimension of the baseportion of the tubular body 4 in which the evaporation source 2 is set,and the area of the opening portion 5 is made smaller than the area ofthe base portion of the tubular body 4. It is preferable that adimension W1 of the short line 5 b of the opening portion 5 is about onehalf to one quarter of a width W2 of the base portion of the tubularbody 4, by which no influence is applied to a resistance of a flow alongwhich the evaporation substance flies. The dimension of the long line 5a of the opening portion 5 is equal to the dimension of the base portionof the tubular body 4. Accordingly, the upper portion of the tubularbody 4 is formed in a shape that an inner diameter is narrowed such thatthe surface close to the long line 5 a is inclined to a diagonally upperside toward an inner side. The other structures such as the carriermeans K and the like are the same as those in FIGS. 9 and 10.

In the structure shown in FIG. 11, the opening area of the openingportion 5 is made smaller by making the dimension of the short line 5 bof the opening portion S in the upper end of the tubular body 4 smallerthan the dimension of the base portion of the tubular body 4 asmentioned above. Accordingly, in the heated tubular body 4, the radiantheat is radiated to the upper side from the inner wall of the tubularbody 4 through the opening portion S, however, it is possible to reducethe radiation of the radiant heat by making the opening area of theopening portion 5 smaller, it is possible to restrict the deposited body3 from being heated by the radiant heat, and it is possible to preventthe temperature of the deposited body 3 from being heated to anevaporation temperature and a decomposition temperature of thedeposition material M, whereby a deposition efficiency is reduced.

FIG. 12 shows the other embodiment of the vacuum deposition device shownin FIG. 9. The control member 8 is provided in each of upper and lowersides of the tubular body 4 in order to control the flying path of thevaporized substance at a time when the vaporized substance from theevaporation source 2 flies and moves to the side of the opening portion5 within the tubular body 4, between the evaporation source 2 set in thebottom portion of the tubular body 4 and the opening portion 5 in theupper end of the tubular body 4. In other words, the control member 8employs a porous plate 10 a arranged just above the evaporation source2, and an obstacle plate 10 b arranged just below the opening portion 5.

The porous plate 10 a is provided with a lot of through holes 9 so as tobe distributed more in a peripheral portion than in a center portion, asshown in FIG. 13(a), and is mounted to the inner surface of the tubularbody 4 so as to section an inner side of the lower end portion of thetubular body 4 into upper and lower sides. Further, a pair of obstacleplates 10 b are provided so as to protrude in opposition to therespective inner surfaces of the opening portion 5 in the side of thelong line 5 a, as shown in FIG. 13(b), and a gap 30 is formed betweenopposing leading ends of the obstacle plates 10 b and 10 b. Further, theleading end edge of each of the obstacle plates 10 b is formed so as toprotrude more in the center portion, whereby a width of the gap betweenthe leading ends of the obstacle plates 10 b and 10 b is narrower in thecenter portion along the long line 5 a of the opening portion 5 and iswider in the end portion. The other structures are the same as those inFIGS. 9 to 11.

In the structure shown in FIG. 12, the evaporation source 2 is fittedand mounted to the center portion of the bottom surface in the tubularbody 4, and the deposition material M is filled in the crucible 23. Theheater 24 for heating the deposition material M is built in the crucible23, and the heating temperature can be detected by the temperaturesensor 25 formed by the thermo couple or the like. Since the evaporationsource 2 is set to the center portion of the bottom portion of thetubular body 4, the vaporized substance 31 from the evaporation source 2flies on the basis of the evaporation source in the center portion ofthe bottom portion of the tubular body 4, however, is blocked by theporous plate 10 a provided just above the evaporation source 2, passesthrough each of a lot of through holes 9 provided in the porous plate 10a, and flies to an upper side of the porous plate 10 a. In this case,since the through holes 9 are provided so as to be distributed more inthe peripheral portion than in the center portion, it is possible toinhibit the vaporized substance 31 from being linearly discharged fromthe crucible 23 so as to go toward the deposited body 3 as it is.Further, the flying vaporized substance 31 is blocked by the obstacle 10b, and flies to the upper side through the gap 30 between the obstacleplates 10 b, however, since the gap 30 is formed so as to be narrower inthe center portion along the long line 5 a of the opening portion 5 andwider in the end portion, the vaporized substance passes through the gap30 while being widened toward the end portion. In the manner mentionedabove, it is possible to prevent the concentration of the vaporizedsubstance 31 from being higher in the center portion of the openingportion 5 and lower in the peripheral portion, whereby it is possible tomake the concentration of the vaporized substance 31 passing through theopening portion 5 uniform in an entire surface of the opening portion 5,and it is possible to further uniformize the film thickness of thedeposition to the deposited body 3.

Although drawings for exclusive use are omitted, a vacuum depositiondevice may employ only the obstacle plate 11 arranged just below theopening portion 5 in the upper end lower control members 8 (refer toFIG. 13(b)), in the device shown in FIG. 12. In accordance with aspecific structure, the tubular body 4 employs a structure which is madeof a stainless steel material (SUS316), has a dimension 420 mm×120mm×height 230 mm, and is formed by winding a sheath heater around anouter wall, and the evaporation source 2 constituted by the crucible 23,the heater 24 and the temperature sensor 25 is fitted to the center ofthe bottom portion of the tubular body 4. The deposition material Memploys Alq3, and is filled in the crucible 23, and the deposited body 3employs the glass substrate of 400 mm×200 mm×thickness 0.7 mm.

Further, the deposition material M is heated by an electric power of avoltage 20 volt and a current 0.4 ampere so as to make the depositedbody 3 standby, and if the rate within the tubular body 4 heated at 240°C. becomes stable, the deposited body 3 is carried in the directionparallel to the short line 5 b of the tubular body 4 at a speed about100 mm/min by an appropriate carrier means K. As a result of carryingout the deposition by using the vacuum deposition device, it is possibleto obtain an effect that the film thickness distribution of thedeposition layer in the deposited body 3 is improved to ±5% or less from±28% in the case that no obstacle plate is provided. In this case, thenumber of the control member 8 may be set to one (singular number) asmentioned here, or may be set to two or more (plural number) as shown inFIG. 12.

FIG. 14 shows the other embodiment of the carrier means K. Thisembodiment is structured as the carrier means K for moving across theopening portion 5 by winding a film sheet deposited body 3 unwound froma unwinding roller (not shown) to a take-up roller (not shown) afterpassing through a pair of rolling rollers 60 and 61 having the samediameter and arranged at the same height level. Since the openingportion 5 and the deposited body 3 are arranged so as to oppose inparallel to each other in the upper position of the tubular body 4 bybuilding the deposited body 3 in a tensional state between two rollingrollers 60 and 61, there is obtained an advantage that a uniform andgood deposition state can be continuously obtained in comparison with,for example, a means that the deposited body 3 is arranged in the upperside of the opening portion 5 in a state of being wound around a singlelarge-diameter rolling roller.

Further, an organic electroluminescent element may be produced bydepositing an organic electroluminescent material as the depositionmaterial M to the film sheet deposited body 3, by using the vacuumdeposition device (or the vacuum deposition method) having the carriermeans K shown in FIG. 1 or 14. The other organic material may be set asthe deposition material M.

Industrial Applicability

As mentioned above, since the vacuum deposition device in accordancewith the present invention is structured such that in the vacuumdeposition device in which the evaporation source and the deposited bodyare arranged within the vacuum chamber, the space between theevaporation source and the deposited body is surrounded by the tubularbody heated at the temperature by which the substance of the evaporationsource is vaporized, and the substance vaporized from the evaporationsource is made to reach the surface of the deposited body through theinner side of the tubular body so as to be deposited, wherein thecontrol member for controlling so as to guide a movement of thevaporized substance toward the deposited body within the tubular body isprovided within the tubular body, it is possible to control thedistribution of the vaporized substance attached to the deposited body,it is possible to apply the deposition to the deposited body at auniform film thickness, and in some cases, it is possible to carry outthe deposition with setting the film thickness distributionintentionally.

Further, since the present invention is structured such that the controlmember is formed by the plate member provided with a plurality ofthrough holes through which the vaporized substance passes, and theplate member is arranged so as to close the inner periphery of thetubular body, it is possible to control the movement of the vaporizedsubstance to the side of the deposited body within the tubular body byinducing by the through hole provided in the plate member, it ispossible to apply the deposition to the deposited body at a uniform filmthickness, and in some cases, it is possible to carry out the depositionwith setting the film thickness distribution intentionally.

Further, since the present invention is structured such that the controlmember is formed by arranging a plurality of through holes in such amanner as to be non-densely distributed in the predetermined portion ofthe plate member and to be densely distributed in the otherpredetermined portion, it is possible to control the induction of thevaporized substance on the basis of the distribution of the density ofthe through hole, it is possible to apply the deposition to thedeposited body at a uniform film thickness, and in some cases, it ispossible to carry out the deposition with setting the film thicknessdistribution intentionally.

Further, since the present invention is structured such that the controlmember is formed in the curved shape corresponding to the curved shapeof the surface to which the deposited body is deposited, it is easy tomake the vaporized substance controlled through the control member touniformly reach to the surface of the deposited body, and it is easy tocarry out the vacuum deposition at the uniform film thickness.

Further, since the present invention is structured such that the controlmember is arranged so as to be approximately parallel to the surface towhich the deposited body is deposited, the distance between each of theportions in the control member and each of the opposing portions in thedeposition surface of the deposited body is uniform, and it is easy tocarry out the vacuum deposition at the uniform film thickness.

Further, since the present invention is structured such that the controlmember is formed by heating up to the temperature by which the substanceof the evaporation source is vaporized, it is possible to re-vaporizethe substance even in the case that the substance vaporized from theevaporation source is attached to the plate member, it is possible toprevent the vaporized substance from being accumulated on the controlmember, whereby the vaporized substance can not be used for thedeposition, and the yield ratio of the deposition is not reduced.

Further, since the present invention is structured such that the openingportion of the tubular body is formed in the rectangular shapeconstituted by the long line and the short line, and the vacuumdeposition device is provided with the means for moving the depositedbody in which the length of the line extending along the long line isshorter than the length of the long line, and the length of the lineextending along the short line is shorter than the length of the shortline, in the direction parallel to the short line so as to cut acrossthe opening portion, it is possible to form the opening portion of thetubular body by the small area even in the case that the deposited bodyhas the large area, and the concentration difference of the evaporationsubstance within the opening portion becomes small. Accordingly, it ispossible to deposit the vaporized substance to the entire surface of thedeposited body at the uniform concentration, and it is possible to carryout the deposition at the uniform film thickness.

Further, since the present invention is structured such that the tubularbody is formed such that the area of the opening portion in the leadingend of the tubular body is smaller than the cross sectional area of thebase portion of the tubular body, by making the dimension of the openingportion in the leading end of the tubular body smaller than thedimension of the base portion of the tubular body in which theevaporation source is set, it is possible to reduce the radiant heatradiated from the opening portion by making the opening area of theopening portion smaller. Accordingly, it is possible to prevent thetemperature of the deposited body from being increased up to theevaporation temperature and the decomposition temperature of theevaporation source due to the heat application by the radiant heat, andit is possible to prevent the deposition efficiency from being lowered.

Further, since the present invention is structured such that the tubularbody is formed such that the area of the opening portion in the leadingend of the tubular body is smaller than the cross sectional area of thebase portion of the tubular body, by making the short line of theopening portion in the leading end of the tubular body smaller than thedimension of the base portion of the tubular body in which theevaporation source is set, it is possible to reduce the radiant heatradiated from the opening portion by making the opening area of theopening portion smaller. Accordingly, it is possible to prevent thetemperature of the deposited body from being increased up to theevaporation temperature and the decomposition temperature of theevaporation source due to the heat application by the radiant heat, andit is possible to prevent the deposition efficiency from being lowered.

Further, since the present invention is structured such that the controlmember employs the porous plate which is arranged in the side close tothe evaporation source and is provided with the through hole passing thesubstance vaporized from the evaporation source therethrough, and a pairof obstacle plates which are arranged in the side close to the openingportion and are provided so as to protrude in opposition to therespective inner surfaces close to the long lines of the openingportion, and the width of the gap between the respective leading ends ofthe obstacle plates becomes narrower toward the center portion of thelong line in the opening portion and wider toward the end portion, it ispossible to uniformize the concentration of the evaporation substancepassing through the opening portion, and it is possible to make the filmthickness of the deposition to the deposited body more uniform.

Further, since the present invention is structured such that the tubularbody is formed in the approximately perpendicularly bent shape so as toopen the opening portion in one end of the tubular body in theapproximately horizontal direction, and the deposited body is arrangedso as to oppose to the opening portion, it is possible to arrange thedeposited body vertically in the case of facing the deposited body tothe opening portion of the tubular body so as to apply the deposition,it is possible to prevent the deposited body from being deformed on thebasis of the application of the gravity, and it is possible to apply thedeposition to the surface of the deposited body at the uniform filmthickness while reducing the deflection of the deposition due to thedeformation of the deposited body.

Further, since the present invention is structured such that a pair ofapproximately perpendicularly bent tubular bodies are arranged so as tooppose opening portions in one end thereof to each other, and thedeposited body is arranged between the opposing opening portions, it ispossible to simultaneously apply the deposition to the surfaces in bothsides of the deposited body from the respective opening portions of apair of tubular bodies, and it is possible to improve the productivityof the deposition process.

Further, since the present invention is structured such that the tubularbody is formed in the shape bent at the approximately 180 degree so asto open the opening portion in one end thereof to the lower side, andthe deposited body is arranged so as to oppose to the opening portion,it is possible to arrange the deposited body horizontally in a state ofsupporting the deposited body to the lower surface, in the case offacing the deposited body to the opening portion of the tubular body soas to apply the deposition, it is possible to prevent the deposited bodyfrom being deformed on the basis of the application of the gravity, andit is possible to apply the deposition to the surface of the depositedbody at the uniform film thickness while reducing the deflection of thedeposition due to the deformation of the deposited body.

Further, the present invention is structured such that the depositedbody is constituted by the plate member having the approximately squareshape in which each of lines is equal to or more than 200 mm. Even inthe deposited body having the large area, it is possible to apply thedeposition to the entire surface of the deposited body at the uniformfilm thickness by using the tubular body having the opening portion withsmall area.

Further, since the present invention is structured such that thedeposited body employs the deposited body having the recess portion, andthe opening portion in one end of the tubular body is formed in theshape which is inserted to the recess portion, it is possible to easilyapply the deposition to the inner surface of the position which is veryhard to be deposited such as the recess portion of the deposited body,by setting the deposited body in a state of inserting the openingportion of the tubular body to the recess portion so as to carry out thedeposition.

Further, since the vacuum deposition method in accordance with thepresent invention is structured such that in the vacuum depositionmethod in which the evaporation source and the deposited body arearranged within the vacuum chamber, the tubular body in which the innersurface is heated at the temperature by which the substance of theevaporation source is vaporized, is arranged between the evaporationsource and the deposited body, and the vaporized substance is depositedto the surface of the deposited body by heating and vaporizing theevaporation source, and making the vaporized substance to reach thesurface of the deposited body while passing through the opening portionof the tubular body from the inner side of the tubular body, wherein thedeposition on the surface of portion of the tubular body, and making thesubstance vaporized from the evaporation source to reach the depositedbody from the opening portion through the control member arranged withinthe tubular body, it is possible to control the distribution of thevaporized substance attached to the deposited body, it is possible toapply the deposition to the deposited body at a uniform film thickness,and in some cases, it is possible to carry out the deposition withsetting the film thickness distribution intentionally.

Further, the present invention can deposit the organicelectroluminescent material to the deposited body by using the vacuumdeposition device and the vacuum deposition method mentioned above,whereby it is possible to efficiently produce the organicelectroluminescent element by depositing the organic electroluminescentmaterial to the deposited body.

DESCRIPTION OF REFERENCE NUMERALS

-   1 vacuum chamber-   2 evaporation source-   3 deposited body-   4 tubular body-   5 opening portion-   5 a long line-   5 b short line-   6 recess portion-   8 control member-   9 through hole-   10 plate member-   10 a porous plate-   10 b obstacle plate-   11 heater-   23 crucible-   24 heater-   25 temperature sensor-   30 gap-   31 vaporized substance-   K carrier means

1. A vacuum deposition device in which an evaporation source and adeposited body are arranged within a vacuum chamber, a space between theevaporation source and the deposited body is surrounded by a tubularbody heated at a temperature by which a substance of the evaporationsource is vaporized, and the substance vaporized from the evaporationsource is made to reach a surface of the deposited body through an innerside of the tubular body so as to be deposited, wherein a control memberfor controlling so as to guide a movement of said vaporized substancetoward the deposited body within said tubular body is provided in a sideclose to the deposited body within said tubular body. 2-20. (canceled)21. The vacuum deposition device according to claim 1, wherein aplurality of through holes through which the vaporized substance passesis provided on the control member and the density of the through holesis high at the specific area of the control member and low at the otherspecific area.
 22. The vacuum deposition device according to claim 21,wherein the density of a plurality of through holes is low at theproximity of the wall of the tubular body and high at the center area ofthe tubular body.
 23. The vacuum deposition device according to claim21, wherein the diameter of a plurality of through holes is formed largeat the proximity of the wall of the tubular body and small at the centerarea of the tubular body.
 24. The vacuum deposition device according toclaim 1, wherein a plurality of the control members through which thevaporized substance passes is arranged so as to close an inner peripheryof the tubular body and at least one of the control members is arrangedat the near side of the deposited body.
 25. The vacuum deposition deviceaccording to claim 1, wherein the control member is formed in a curvedshape corresponding to a curved shape of the surface to which thedeposition material is deposited.
 26. The vacuum deposition deviceaccording to claim 1, wherein the control member is arranged so as to beapproximately parallel to the surface to which the deposition materialis deposited.
 27. The vacuum deposition device according to claim 1,wherein the control member is formed by heating up to a temperature bywhich the substance of the evaporation source is vaporized.
 28. Thevacuum deposition device according to claim 1, wherein, an openingportion of the tubular body is formed in a rectangular shape constitutedby a long line and a short line, and the vacuum deposition device isprovided with a means for moving the deposited body in which a length ofa line extending along said long line is shorter than a length of saidlong line, and a length of a line extending along said short line islonger than a length of said short line, in a direction parallel to saidshort line so as to cut across said opening portion.
 29. The vacuumdeposition device according to claim 1, wherein said tubular body isformed such that an area of an opening portion in said leading end ofthe tubular body is smaller than a cross sectional area of a baseportion of the tubular body, by making a dimension of the openingportion in the leading end of the tubular body smaller than a dimensionof the base portion of the tubular body in which the evaporation sourceis set.
 30. The vacuum deposition device according to claim 28, whereinsaid tubular body is formed such that an area of an opening portion insaid leading end of the tubular body is smaller than a cross sectionalarea of a base portion of the tubular body, by making a dimension of theopening portion in the leading end of the tubular body smaller than adimension of the base portion of the tubular body in which theevaporation source is set.
 31. The vacuum deposition device according toclaim 28, wherein said control member is constituted by a porous platewhich is arranged in a side close to the evaporation source and isprovided with a through hole passing the substance evaporated from theevaporation source there through, and a pair of obstacle plates whichare arranged in a side close to the opening portion and are provided soas to protrude in opposition to respective inner surfaces close to thelong lines of the opening portion, and a width of a gap between therespective leading ends of the obstacle plates becomes narrower towardthe center portion of the long line in the opening portion and widertoward the end portion.
 32. The vacuum deposition device according toclaim 30, wherein said control member is constituted by a porous platewhich is arranged in a side close to the evaporation source and isprovided with a through hole passing the substance evaporated from theevaporation source there through, and a pair of obstacle plates whichare arranged in a side close to the opening portion and are provided soas to protrude in opposition to respective inner surfaces close to thelong lines of the opening portion, and a width of a gap between therespective leading ends of the obstacle plates becomes narrower towardthe center portion of the long line in the opening portion and widertoward the end portion.
 33. The vacuum deposition device according toclaim 1, wherein the tubular body is formed in an approximatelyperpendicularly bent shape so as to open an opening portion in one endof the tubular body in an approximately horizontal direction, and thedeposited body is arranged so as to oppose to the opening portion. 34.The vacuum deposition device according to claim 1, wherein a pair ofapproximately perpendicularly bent tubular bodies are arranged so as tooppose opening portions in one end thereof to each other, and thedeposited body is arranged between the opposing opening portions. 35.The vacuum deposition device according to claim 1, wherein the tubularbody is formed in a shape bent at an approximately 180 degree so as toopen an opening portion in one end thereof to a lower side, and thedeposited body is arranged so as to oppose to the opening portion. 36.The vacuum deposition device according to claim 1, wherein the depositedbody is formed as a plate member having an approximately square shape inwhich each of lines is equal to or more than 200 mm.
 37. The vacuumdeposition device according to claim 1, wherein the deposited bodyemploys a deposited body having a recess portion, and the openingportion in one end of the tubular body is formed in a shape which isinserted to the recess portion.
 38. A vacuum deposition device in whichan evaporation source and a deposited body are arranged within a vacuumchamber, a space between the evaporation source and the deposited bodyis surrounded by a tubular body heated at a temperature by which asubstance of the evaporation source is vaporized, and the substancevaporized from the evaporation source is made to reach a surface of thedeposited body through an inner side of the tubular body so as to bedeposited, wherein an opening portion of the tubular body is formed in arectangular shape constituted by a long line and a short line, and thevacuum deposition device is provided with a means for moving thedeposited body in which a length of a line extending along said longline is shorter than a length of said long line, and a length of a lineextending along said short line is longer than a length of said shortline, in a direction parallel to said short line so as to cut acrosssaid opening portion.
 39. A vacuum deposition method in which anevaporation source and a deposited body are arranged within a vacuumchamber, a tubular body in which an inner surface is heated at atemperature by which a substance of the evaporation source is vaporized,is arranged between the evaporation source and the deposited body, andthe vaporized substance is deposited to a surface of the deposited bodyby heating and vaporizing the evaporation source, and making thevaporized substance to reach the surface of the deposited body whilepassing through the opening portion of the tubular body from the innerside of the tubular body, wherein the deposition on the surface of saiddeposited body is achieved by arranging said deposited body so as toface to the opening portion of said tubular body, and making thesubstance vaporized from the evaporation source to reach said depositedbody from said opening portion through the control member arranged in aside close to the deposited body within the tubular body.
 40. An organicelectroluminescent element produced by employing the vacuum depositiondevice according to claim
 1. 41. An organic electroluminescent elementproduced by employing the vacuum deposition device according to claim38.
 42. An organic electroluminescent element produced by employing thevacuum deposition device according to claim 39.